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IEEE TTEP TUTORIALS
@
IEEE International Test Conference
Test Week

(ITC/Test Week 2010)

October 31 - November 1, 2010
Austin Convention Center
Austin, TX, USA

www.itctestweek.org

Advance Registration Deadline October 1st, 2010!
CALL FOR PARTICIPATION

Scope -- Key Dates -- Venue -- Workshop Registration -- Advance Program -- Test Clinic

Scope

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The Tutorials & Education Group of the IEEE Computer Society Test Technology Technical Council (TTTC) organizes a comprehensive set of Test Technology Tutorials to be held in conjunction with several TTTC-sponsored technical meetings worldwide. The mission of the Test Technology Educational Program (TTEP) is to serve test and design professionals by offering fundamental education and expert knowledge in state-of-the-art test technology topics. TTEP offers tutorial participants the opportunity to earn official certification from IEEE Computer Society TTTC. Each full-day tutorial corresponds to four TTEP units. Upon completion of sixteen TTEP units, official recognition in the form of an IEEE TTTC Test Technology Certificate will be presented to the participant. For further information regarding TTEP, please visit http://tab.computer.org/tttc/teg/ttep/

At ITC 2010, TTTC/TTEP is pleased to present twelve full-day tutorials on topics of current interest to test professionals and researchers and a test clinic geared toward students and newcomers to test. All tutorials qualify for credit towards IEEE TTTC certification under the TTEP program. Five tutorials are held on Sunday, October 31. Seven tutorials will be held on Monday, November 1st. Each tutorial requires a separate registration fee (see ITC registration form or www.itctestweek.org for further information). Admission for on-site registrants is subject to availability.

Tutorial attendees receive study material, breakfast, lunch, and coffee breaks. The study material includes a hardcopy of the presentation and bibliographical material. Tutorial registration, coffee and pastry are available at 7:00 a.m. on Sunday and Monday.

Key Dates
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Advance Registration Deadline: October 1st 2010!

The Venue
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The ITC conference and all associated Test Week events will be held at the Austin Convention Center, Austin, Texas. Austin is the capital of the state of Texas, and its 1888 capitol building is an interesting landmark. Also of interest are the main campus of The University of Texas and the Lyndon B. Johnson Library and Museum. Close to the convention center is the lively East Sixth Street entertainment district which features many restaurants and a variety of music in the ―Live Music Capital of the World‖. The downtown area has miles of waterfront trails suitable for walking and jogging and is also home to the largest urban bat population in the US whose spectacular flight can be observed just before sunset. For more information about Austin, visit http://www.austintexas.org. Lodging for Test Week is in several hotels in the vicinity of the convention center.
Registration
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On-line Registration

Advance Program
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Sunday -- Monday

October 31, 2010 (Sunday)
 
8:30 AM - 4:30 PM TUTORIAL 1 - Practices in Analog, Mixed-Signal and RF Testing
Presenters: S. Abdennadher, S. Shaikh
 
8:30 AM - 4:30 PM TUTORIAL 2 - Parameter Variations and Low-Power Design: Test Issues and On-Chip Calibration/Repair Solutions
Presenters: R. Rao, S. Mukhopadhyay, S. Bhunia, P. Elakkumanan
 
8:30 AM - 4:30 PM TUTORIAL 3 - High-Quality and Low-Cost Delay Testing for VDSM Designs: Challenges and Solutions
Presenters: M. Tehranipoor, K. Chakrabarty, J. Rearick
 
8:30 AM - 4:30 PM TUTORIAL 4 - Reliability, Availability and Serviceability of Networks-on-Chip
Presenters: E. Cota, M. Lubaszewski
 
8:30 AM - 4:30 PM TUTORIAL 5 - The Economics of Test and Testability
Presenters: S. Davidson, H. Colby, L. Ungar
 
November 1, 2010 (Monday)
 
8:30 AM - 4:30 PM TUTORIAL 6 - Testing Low-Power Integrated Circuits: Challenges, Solutions, and Industry Practices
Presenters: S. Ravi, R. Kapur, M. Tehranipoor
 
8:30 AM - 4:30 PM TUTORIAL 7 - Testing TSV-based 3-D Stacked ICs
Presenters: E J. Marinissen, Y. Zorian
 
8:30 AM - 4:30 PM TUTORIAL 8 - The Convergence and Inter-relationship of Yield, Design for Manufacturability and Test
Presenters: S. Venkataraman, R. Aitken
 
8:30 AM - 4:30 PM TUTORIAL 9 - Statistical Adaptive Test Methods Targeting "Zero Defect" IC Quality and Reliability
Presenter: A. Singh
 
8:30 AM - 4:30 PM TUTORIAL 10 - Bridge to Moore—IEEE Standards Provide Access to Debug, Validation and Test of Ever More Complex ICs—On ATE, on Board, in System
Presenters: A. Ley, A. Crouch
 
8:30 AM - 4:30 PM TUTORIAL 11 - Post-Silicon Validation and Debug
Presenters: N. Nicolici, J. Stinson, B. Vermeulen
 
8:30 AM - 4:30 PM TUTORIAL 12 - Post-Silicon Validation and Debug
Presenters: N. Nicolici, J. Stinson, B. Vermeulen
 
TTTC/TTEP TEST CLINIC
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In addition to the regular tutorials, TTTC/TTEP is offering at ITC 2010 a Test Clinic, particularly geared towards newcomers to the area of test, such as new test engineers and students pursuing graduate studies in test. Its key objective is to offer a broad yet comprehensive review of basic test topics in an accessible way to the lay audience. This year’s topic will be Logic and Memory Testing for SOCs.

The Test Clinic will be a full-day event. Upon its completion, an official recognition in the form of an IEEE TTTC Test Technology Certificate will be presented to each participant.

For further information regarding TTEP, please visit http://tab.computer.org/tttc/teg/ttep/ The Test Clinic requires a separate registration fee (see ITC registration form or www.itctestweek.org for further information). Admission for on-site registrants is subject to availability.

Test Clinic attendees receive study material, breakfast, lunch, and coffee breaks. The study material includes a hardcopy of the presentation and bibliographical material. Test Clinic registration, coffee and pastry are available at 7:00 a.m. on Monday.

8:30 AM - 4:30 PM TEST CLINIC Logic and Memory Testing for SOCs
Presenters: A. Cron, Y. Zorian
  Testability is a fundamental requirement for today’s systems-on-chip. These integrated circuits are typically designed based on intellectual property (IP) block integration to make the best use of millions of gates available. Logic and memory IP blocks require adequate fault detection, silicon debug and yield optimization. All of which are based on testability infrastructure build into the systems-on-chip. This tutorial presents the fundamental knowledge base that any designer or testability engineer must have in order to fulfill the current industrial best practices for design-for-testability. The tutorial discusses the requirements for block-level test architecting, at-speed design practices, scan compression, memory self-test, debug and repair, test interface standardization efforts such as IEEE Std 1149.1 (JTAG) and IEEE Std. 1500, and integration for system-on-chip level and beyond. Actual industrial experiences will be shared with the audience whenever possible.

 

For more information, visit us on the web at:http:/www.itctestweek.org

TTEP is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).


IEEE Computer Society- Test Technology Technical Council

TTTC CHAIR
Adit D. SINGH
Auburn University - USA
Tel. +1-334-844-1847
E-mail adsingh@eng.auburn.edu

PAST CHAIR
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

TTTC 1ST VICE CHAIR
Michael NICOLAIDIS
TIMA Laboratory - France
Tel. +33-4-765-74696
E-mail michael.nicolaidis@imag.fr

SECRETARY
Christian LANDRAULT
LIRMM - France
Tel. +33-4-674-18524
E-mail landrault@lirmm.fr

ITC GENERAL CHAIR
Gordon W. ROBERTS
McGill University
- Canada
Tel. +1-514-398-6029
E-mail gordon.roberts@mcgill.ca

TEST WEEK COORDINATOR
Yervant ZORIAN
Virage Logic Corporation - USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com

TUTORIALS AND EDUCATION
Dimitris GIZOPOULOS

University of Piraeus
- Greece
Tel. +30-210-414-2372
E-mail dgizop@unipi.gr

STANDARDS
Rohit KAPUR

Synopsys
, Inc. - USA
Tel. +1-650-934-1487
E-mail rkapur@synopsys.com

EUROPE
Zebo PENG
Linköping University - Sweden
Tel. +46-13-282-067/-281-000
E-mail zpe@ida.liu.se

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut - Lebanon
Tel. +961-1-341-952
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
André IVANOV
University of British Columbia - Canada
Tel. +1-604-822-6936
E-mail ivanov@ece.ubc.ca

ELECTRONIC MEDIA
Alfredo BENSO
Politecnico di Torino - Italy
Tel. +39-011-564-7080
E-mail alfredo.benso@polito.it

 

PRESIDENT OF BOARD
Yervant ZORIAN
Virage Logic Corporation- USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com

SENIOR PAST CHAIR
Paolo PRINETTO
Politecnico di Torino - Italy
Tel. +39-011-564-7007
E-mail Paolo.Prinetto@polito.it

TTTC 2ND VICE CHAIR
Chen-Huan CHIANG

Alcatel-Lucent
- USA
Tel. +1-973-386-6759
E-mail chenhuan@alcatel-lucent.com

FINANCE
Michael NICOLAIDIS
TIMA Laboratory - France
Tel. +33-4-765-74696
E-mail michael.nicolaidis@imag.fr

IEEE DESIGN & TEST EIC
K.T. (Tim) CHENG
University of California, Santa Barbara - USA
Tel. +1-805-893-72942
E-mail timcheng@ece.ucsb.edu

TECHNICAL MEETINGS
Chen-Huan CHIANG
Alcatel-Lucent
- USA
Tel. +1-973-386-6759
E-mail chenhuan@alcatel-lucent.com

TECHNICAL ACTIVITIES
Matteo SONZA REORDA
Politecnico di Torino - Italy
Tel.+39-011-564-7055
E-mail matteo.sonzareorda@polito.it

ASIA & PACIFIC
Kazumi HATAYAMA
STARC - Japan
Tel. +
E-mail hatayama.kazumi@starc.or.jp

LATIN AMERICA
Victor Hugo CHAMPAC
Instituto Nacional de Astrofisica - Mexico
Tel.+52-22-470-517
E-mail champac@inaoep.mx

NORTH AMERICA
William R. MANN
SW Test Workshop - USA
Tel. +1-949-645-3294
E-mail william.mann@ieee.org

COMMUNICATIONS
Cecilia METRA
Università di Bologna - Italy
Tel. +39-051-209-3038
E-mail cmetra@deis.unibo.it

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Virage Logic Corporation- USA
Tel. +1-510-360-8035
E-mail yervant.zorian@viragelogic.com


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